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  10 commonly used chip packaging technologies

  The ratio of chip area to package area improves the package efficiency, which is as close as possible to 1: 1;

  2025-09-06 4486

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  Congratulations on the new launch of Liddell website.

  In order to better promote and display the company's image, strengthen network publicity, enhance user experience and create favorable conditions for the company's operation and development, our website has been successfully upgraded and revised!

  2025-09-06 4007

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  What is the potential of FPC industry?

  In the past decade, China's electronic information industry has developed rapidly, and the scale of the industry has been expanding. China has become the world's largest consumer electronics market, and the upstream and downstream industrial chains fully

  2025-09-06 4518

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  Understand packaging technology

  The so-called "packaging technology" is a technology of packaging integrated circuits with insulating plastic or ceramic materials.

  2025-09-06 4419

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